In this episode of Photonics Hot List: Researchers at Shenzhen University in China have designed a sensor that’s so sensitive, it can detect even trace concentrations of cancer biomarkers. It could someday make possible early cancer detection via a simple blood test. Business news roundup: LightPath Technologies has finalized the acquisition of Amorphous Materials, while

All-optical physiology (AOP), which enables simultaneous monitoring and manipulation of neuronal circuits in vivo, shows promise for taking neuroscience beyond correlation to causality. Many research groups have shown the potential of AOP for dissection of functional circuits within single field of views (FOVs), but no techniques based on AOP existed to explore functional columns, which

In this episode of Photonics Hot List: A device developed by a team led by researchers at Tianjin University in China is showcasing the potential of terahertz waves to more reliably and securely encode information for wireless communications applications. Business news roundup: Greater Rochester Enterprise and New York Photonics are joining forces to further boost

With the rapid rise of artificial intelligence (AI) and cloud services, internal data links inside data centers must support speeds well above 100 Gbit/s, or roughly 1,000x faster than a typical digital subscriber line (DSL) connection. To deliver these rates reliably, the cables and the copper connections that form the network backbone must be welded

Advances in computing power continue to move at a faster pace than those for interconnects, and this creates a bottleneck within artificial intelligence (AI)-scale data centers. Unless interconnects can improve, this is likely to become the limiting factor in enabling next-gen architectures needed to support complex large language and inference models. To minimize this bottleneck

Figure 1c shows a configuration for wafer-level applications scalable to different sizes by selecting appropriate F-theta focal lengths. For example, a 300-mm focal length system provides coverage for 200- to 300-mm wafers with spot sizes of 10 to 50 μm for scribing. Double-sided scribing. Silicon wafers for power semiconductors and solar cells require scribe lines