Dual-sided laser processing can tap static beam shaping and splitting
Figure 1c shows a configuration for wafer-level applications scalable to different sizes by selecting appropriate F-theta focal lengths. For example, a 300-mm focal length system provides coverage for 200- to 300-mm wafers with spot sizes of 10 to 50 μm for scribing. Double-sided scribing. Silicon wafers for power semiconductors and solar cells require scribe lines […]
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